Intel® 6th-Gen Skylake Core™ i7/i5/i3 In-Vehicle Controller with 4x M12 PoE+ Ports, DIO, CAN bus and RAID
- Supports Intel® 6th-Gen Core™ i7/i5/i3 LGA1151 CPU
- 4x 802.3at Gigabit PoE+ ports via M12 connectors
- On-board CAN bus for in-vehicle communication
- 4-CH isolated DI and 4-CH isolated DO
- 2x SATA ports for two 2.5″ SATA HDD/SSD, with one hot-swappable HDD tray, supporting RAID 0/1
- 4x full-size mini-PCIe sockets with SIM support
- 8~35V wide-range DC input with built-in ignition control
- EN 50155 certificate (EN 50121-3-2 / EN50121-2-1 / EN50121-2-2 / EN61373)
Product Highlights
6th-Gen Core i CPU
Powered by Intel® Skylake Core™ processor running with advanced Intel® Q170 chipset, Nuvo-5100VTC provides outstanding performance for emerging high-end requirement. The latest in-vehicle fanless controller delivers 40% increase in terms of performance per watt than former generations.
M12 X-coded
Nuvo-5100VTC offers four 802.3 PoE+ ports of M12 X-coded connector to supply 25W power. M12 connector can guarantee connectivity in shocking/vibrating environment. In addition, M12 X-coded connector not only provides higher rated voltage and surge voltage, also offers faster data transmission than A-coded connector.
Wide Temperature
Nuvo-5100VTC has patented thermal design, and it can distributes the hot components to average the thermal condition for each area. Nuvo-5100VTC can truly operate(100% CPU loading) under wide temperature range from -25℃ to 70℃.
CAN bus Design
CAN bus is a vehicle bus standard designed to allow microcontrollers and devices to communicate with each other in applications without a host computer. Nuvo-5100VTC built-in CAN bus supports the bit rate up to 1Mbps for both CAN 2.0A & CAN 2.0B.
Specification
System Core |
|
|---|---|
| Processor | Supports Intel® Core™ i7/i5/i3 LGA1151 CPU -Core™ i7-6700TE(8M Cache, 2.4/3.4 GHz, 35W TDP) -Core™ i5-6500TE(6M Cache, 2.3/3.3 GHz, 35W TDP) -Core™ i3-6100TE(4M Cache, 2.7 GHz, 35W TDP) |
| Chipset | Intel® Q170 Platform Controller Hub |
| Graphics | Integrated Intel® HD Graphics 530 |
| Memory | Up to 32 GB DDR4-2133 SDRAM by two SODIMM sockets |
| AMT | Supports AMT 11.0 |
| TPM | Supports TPM 2.0 |
I/O Interface |
|
|---|---|
| Ethernet | 2x Gigabit Ethernet ports by Intel® I219 and I210 |
| PoE+ | 4x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210, M12 x-coded connector |
| CAN | 1x CAN 2.0 port |
| Isolated DIO | 4x isolated DI and 4x isolated DO |
| USB | 4x USB 3.0 ports via native XHCI controller 4x USB 2.0 ports |
| Video Port | 1x stacked VGA + DVI-D connector 2x DisplayPort connectors, supporting 4K2K resolution |
| Serial Port | 2x software-programmable RS-232/422/485 port (COM1 & COM2) 1x RS-232 port (COM3) |
| Audio | 1x Mic-in and 1x Speaker-out |
Storage Interface |
|
|---|---|
| SATA HDD | 1x hot-swappable HDD tray for 2.5” HDD/SSD installation 1x Internal SATA port for 2.5” HDD/SSD installation, supporting RAID 0/1 |
| mSATA | 1x full-size mSATA port (mux with mini-PCIe) |
Expansion Bus |
|
|---|---|
| Mini PCI-E | 1x full-size mini-PCIe socket with panel-accessible SIM socket 1x full-size mini-PCIe socket with internal SIM socket (mux. with mSATA) 2x full-size mini-PCIe sockets (USB signals only) with internal SIM sockets |
Power Supply |
|
|---|---|
| DC Input | 1x 3-pin pluggable terminal block for 8~35VDC DC input |
| Remote Ctrl. & Status Output |
1x 10-pin (2×5) wafer connector for remote on/off control and status LED output |
Mechanical |
|
| Dimension | 240 mm (W) x 225 mm (D) x 79 mm (H) |
| Weight | 3.3 Kg |
| Mounting | Neousys’ patented damping bracket (standard) or optional DIN-Rail mounting |
Environmental |
|
|---|---|
| Operating Temperature | -40°C ~ 70°C */** |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 10%~90% , non-condensing |
| Vibration | Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) |
| Shock | Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) |
| EMC | CE/FCC Class A, according to EN 55022 & EN 55024 |
| Certification | EN50155 TX Class |