Nuvo-5100VTC

posted in: N-In-Vehicle Computing | 0

Intel® 6th-Gen Skylake Core™ i7/i5/i3 In-Vehicle Controller with 4x M12 PoE+ Ports, DIO, CAN bus and RAID

  • Supports Intel® 6th-Gen Core™ i7/i5/i3 LGA1151 CPU
  • 4x 802.3at Gigabit PoE+ ports via M12 connectors
  • On-board CAN bus for in-vehicle communication
  • 4-CH isolated DI and 4-CH isolated DO
  • 2x SATA ports for two 2.5″ SATA HDD/SSD, with one hot-swappable HDD tray, supporting RAID 0/1
  • 4x full-size mini-PCIe sockets with SIM support
  • 8~35V wide-range DC input with built-in ignition control
  • EN 50155 certificate (EN 50121-3-2 / EN50121-2-1 / EN50121-2-2 / EN61373)

Product Highlights

6th-Gen Core i CPU

Powered by Intel® Skylake Core™ processor running with advanced Intel® Q170 chipset, Nuvo-5100VTC provides outstanding performance for emerging high-end requirement. The latest in-vehicle fanless controller delivers 40% increase in terms of performance per watt than former generations.

6th-Gen Core i CPU

M12 X-coded

Nuvo-5100VTC offers four 802.3 PoE+ ports of M12 X-coded connector to supply 25W power. M12 connector can guarantee connectivity in shocking/vibrating environment. In addition, M12 X-coded connector not only provides higher rated voltage and surge voltage, also offers faster data transmission than A-coded connector.

M12 X-coded

Wide Temperature

Nuvo-5100VTC has patented thermal design, and it can distributes the hot components to average the thermal condition for each area. Nuvo-5100VTC can truly operate(100% CPU loading) under wide temperature range from -25℃ to 70℃.

wide temperature range from -25℃ to 70℃

CAN bus Design

CAN bus is a vehicle bus standard designed to allow microcontrollers and devices to communicate with each other in applications without a host computer. Nuvo-5100VTC built-in CAN bus supports the bit rate up to 1Mbps for both CAN 2.0A & CAN 2.0B.


Specification

System Core

Processor Supports Intel® Core™ i7/i5/i3 LGA1151 CPU
-Core™ i7-6700TE(8M Cache, 2.4/3.4 GHz, 35W TDP)
-Core™ i5-6500TE(6M Cache, 2.3/3.3 GHz, 35W TDP)
-Core™ i3-6100TE(4M Cache, 2.7 GHz, 35W TDP)
Chipset Intel® Q170 Platform Controller Hub
Graphics Integrated Intel® HD Graphics 530
Memory Up to 32 GB DDR4-2133 SDRAM by two SODIMM sockets
AMT Supports AMT 11.0
TPM Supports TPM 2.0

I/O Interface

Ethernet 2x Gigabit Ethernet ports by Intel® I219 and I210
PoE+ 4x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210,
M12 x-coded connector
CAN 1x CAN 2.0 port
Isolated DIO 4x isolated DI and 4x isolated DO
USB 4x USB 3.0 ports via native XHCI controller
4x USB 2.0 ports
Video Port 1x stacked VGA + DVI-D connector
2x DisplayPort connectors, supporting 4K2K resolution
Serial Port 2x software-programmable RS-232/422/485 port
(COM1 & COM2)
1x RS-232 port (COM3)
Audio 1x Mic-in and 1x Speaker-out

Storage Interface

SATA HDD 1x hot-swappable HDD tray for 2.5” HDD/SSD installation
1x Internal SATA port for 2.5” HDD/SSD installation,
supporting RAID 0/1
mSATA 1x full-size mSATA port (mux with mini-PCIe)

Expansion Bus

Mini PCI-E 1x full-size mini-PCIe socket with panel-accessible SIM socket
1x full-size mini-PCIe socket with internal SIM socket
(mux. with mSATA)
2x full-size mini-PCIe sockets (USB signals only) with internal
SIM sockets

Power Supply

DC Input 1x 3-pin pluggable terminal block for 8~35VDC DC input
Remote Ctrl. &
Status Output
1x 10-pin (2×5) wafer connector for
remote on/off control and status LED output

Mechanical

Dimension 240 mm (W) x 225 mm (D) x 79 mm (H)
Weight 3.3 Kg
Mounting Neousys’ patented damping bracket (standard) or optional
DIN-Rail mounting

Environmental

Operating Temperature -40°C ~ 70°C */**
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Shock Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
EMC CE/FCC Class A, according to EN 55022 & EN 55024
Certification EN50155 TX Class